HOME       >>   PCB-Chemical >> mSAP-Inorganic-Stripper

mSAP-Inorganic-Stripper


[1] Product introduction
G-300 is a kind of thick-film dry-film peeling used in semi-addition and other micro-pattern forming processes. It is suitable for soaking or spraying operation, and has the characteristics of long liquid life and short peeling time. G-300 is a concentrated additive in liquid alkali. There are no organic amines, fluorides and phosphates.

[2] Main characteristics
1. It has good permeability and high removal rate of clamp in electrograph.
2. The peeling speed is not fast, but for the thick film formed by copper pillars or bumps, the intrusion peeling is particularly effective.
3. It is suitable for the removal of various types of dry films.
4. Very low consumption and low production cost;


DongGuan Innovate Electronic Technology Copyright© 2018    粤ICP 19140739号
TEL:+86 0769 81209289    FAX:+86 0769 81209869    MOB:+86 13802380327     E-mail:taylor.innovate@outlook.com
BeiWang Road No.63, Zhongtan town, Donguan city Guangdong Province PRC 

Online