1. equipment advantages

-- coping with thin plate and thin plate capacity (PI min 0.03mm);
- high degree of automation;
- online analysis (optional slot automatic analysis and addition device);
- plating copper uniformity ability reached; extreme range R<+-10%, Cov<8%;
- the mature and collocation experience with the big brand water merchant;

2. equipment application 
--FPC panel plating and pattern plating;
- 250mm width and 500mm width RTR;
- with FPC filling and high current density (1-8ASD) plating capability;

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