1. the latest surface treatment technology that can be matched by our company

2.ENEPIG/EPIG technology solution
Technical features: Ni groove stability; Thin Ni EPIG technology with low nickel thickness of the uniformity of different graphics control; technology application advantages: small spacing products, suitable for welding and Wire Bonding technology;

3. OSP technical solution
Technical features: OSP film heat resistance and Cu2+ discoloration ability; technical application advantages: small Pad products, and gold surface need OSP carrier plate;

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