1. OSP application field
-- Japan's brand: Tamura .
--OSP type: WPF-207;
--OSP  is mainly suitable for Package substrates, especially suitable for small spacing lines and substrates with gold.

2. OSP  advantage
- it can prevent the discoloration of the gold plating.
- the organic film between 0.25-0.5um and thickness can be formed only in 60~90 seconds.
- there is a set of copper ion removal to reduce the number of slots caused by the mixing of copper ions.
- because of the uniform formation of thin film, the copper foil has excellent flatness and is very suitable for high density packaging substrate.

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