1. equipment advantages:
-- coping with thin plate and thin plate capability (FR4 min 0.035mm, BT min 0.04mm, PI min 0.03mm);
- high automation, automatic feeding and unloading;
- online analysis (optional slot automatic analysis and addition device);
- plating copper uniformity ability reached; extreme range R<+-10%, Cov<8%;

2. equipment application :
- - suitable for PCB  multilayer plate plating;
- suitable for HDI and substrate plating, MSAP and SAP plating.
- - for plate FPC electroplating;
It is suitable for electroplating with high thickness to diameter ratio blind hole (1:1), and filling hole (blind hole and through hole).

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