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PCB electroplating filler additive (Japan OKUNO Oro chemical brand)

1. OKUNO introduction
OKUNO is a well-known Japanese chemical pharmaceutical manufacturer in Japan, which has a good market share in the field of surface treatment and PCB medicine in Japan, especially the FPC nickel gold medicine water, PCB electroplated copper, SAP process series of water, etc., in Japan, the main customers include IBIDEN, SHINKO, TOSHIBA and so on; high current density FPC electroplating copper medicine water is in the country The internal application is the most extensive, MEKTEK, FUJIKIRA and so on.

2. Applicaiton

It is suitable for filling with medium and high current density, and the highest current density can reach 10ASD (HV).
It is suitable for FPC and HDI, blind hole filling and hole plating.
- suitable for MSAP and SAP process plating (NSV), with excellent plating uniformity.

3. OKUNO Via Filling chemical type and Characteristic

Chemical	BVF	α	NSV	FA	HV
Use	BVH plating	TH/BVH plating	MSAP/SAP	For insoluble anode only	High density
CuSO4.5H2O	200g/L	200g/L	100g/L	200g/L	200g/L
H2SO4	50g/L	50g/L	180g/L	50g/L	50g/L
Cl-	50mg/L	50mg/L	6mg/L	50mg/L	50mg/L
Carrier	BVF-1 5.0ml/L	α-M 4.5ml/L	NSV-1 4.0ml/L	FA-1 5.0ml/L	HV-A 5.0ml/L
Brighter	BVF-2 1.5ml/L	α-2 1.0ml/L	NSV-2 0.5ml/L	FA-2 0.4ml/L	HV-B 1.0ml/L
Levler	BVF-3 0.5ml/L	α-3 3.0ml/L	NSV-3 1.0ml/L	FA-3 4.0ml/L
Anode	Cu-P/ Insoluble	Cu-P/ Insoluble	Cu-P/ Insoluble	Insoluble	Cu-P/ Insoluble
Current density	2.0A/dm2	1.0A/dm2	1.0A/dm2	1.5A/dm2	2.0-6.0A/dm2
BVH diameter	50～200μm	30～130μm	30～80μm	50～150μm	30～130μm
Filling performance	◎	△	△	○	◎
Plating speed	○	△	×	○	◎
Plating uniformity	×	○	◎	△	△
Filling stability	○	△	△	◎	○
Control range	○	△	△	○	◎

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